Wafer carrier with reticle template for marking reticle fields on a semiconductor wafer
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United States of America
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Dec 31, 2024
Grant Date -
Sep 7, 2023
app pub date -
Mar 3, 2022
filing date -
Mar 3, 2022
priority date (Note) -
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Abstract
A wafer carrier assembly comprising a wafer carrier having a first and second side, the first side including: a circular recess configured to receive a semiconductor device wafer, and at least one cut-out arranged along the circumference of the circular recess. The first side also includes a carrier cover having a top and bottom side, the top side including: a plurality of gridlines extending to edges of the carrier cover, and a plurality of reticles extending from the top side to the bottom side where subsets of reticles are arranged to have a common center and each subset of reticles is arranged at each intersection of the plurality of gridlines.
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