Integrated dry processes for patterning radiation photoresist patterning

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12183604
APP PUB NO 20230290657A1
SERIAL NO

18184545

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Abstract

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Methods for making thin-films on semiconductor substrates, which may be patterned using EUV, include: depositing the organometallic polymer-like material onto the surface of the semiconductor substrate, exposing the surface to EUV to form a pattern, and developing the pattern for later transfer to underlying layers. The depositing operations may be performed by chemical vapor deposition (CVD), atomic layer deposition (ALD), and ALD with a CVD component, such as a discontinuous, ALD-like process in which metal precursors and counter-reactants are separated in either time or space.

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Patent Owner(s)

  • LAM RESEARCH CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Alvi, Mohammed Haroon San Jose, US 3 15
Gottscho, Richard Alan Menlo Park, US 14 393
Hubacek, Jerome S Fremont, US 14 465
Kanakasabapathy, Sivananda Krishnan Pleasanton, US 16 97
LaVoie, Adrien Newberg, US 198 18204
Lin, Qinghuang Yorktown Heights, US 152 2344
Pan, Yang Los Altos, US 310 4868
Tan, Samantha S H Newark, US 23 240
Weidman, Timothy William Sunnyvale, US 33 427
Wise, Richard Los Gatos, US 74 1883
Yu, Jengyi San Ramon, US 49 1139

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