Structures and process flow for integrated photonic-electric ic package by using polymer waveguide

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United States of America

PATENT NO 12181722
APP PUB NO 20230384538A1
SERIAL NO

18232317

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Abstract

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Disclosed are apparatus and methods for a silicon photonic (SiPh) structure comprising the integration of an electrical integrated circuit (EIC); a photonic integrated circuit (PIC) disposed on top of the EIC; two or more polymer waveguides (PWGs) disposed on top of the PIC and formed by layers of cladding polymer and core polymer; and an integration fan-out redistribution (InFO RDL) layer disposed on top of the two or more PWGs. The operation of PWGs is based on the refractive indexes of the cladding and core polymers. Inter-layer optical signals coupling is provided by edge-coupling, reflective prisms and grating coupling. A wafer-level system implements a SiPh structure die and provides inter-die signal optical interconnections among the PWGs.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD8 LI-HSIN RD 6 HSINCHU SCIENCE PARK HSINCHU 300-78

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Yu-Hao Hinchu, TW 61 370
Kuan, Jui-Feng Zhubei, TW 68 360
Lee, Hui-Yu Hsin-Chu, TW 24 62
Weng, Chung-Ming Hsin-Chu, TW 39 17
Wu, Chien-Te Hsin-Chu, TW 38 48

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