Probe head and substrate inspection device including the same
Number of patents in Portfolio can not be more than 2000
United States of America
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Dec 31, 2024
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N/A
app pub date -
Mar 4, 2024
filing date -
Mar 4, 2024
priority date (Note) -
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status (Latency Note)
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Abstract
A probe head includes a test board configured to test a reliability of a semiconductor substrate by contacting the semiconductor substrate, a load pusher provided on the test board, the load pusher including a frame, a plurality of elastic structures, and a loader blade, the frame having a penetration region, the plurality of elastic structures extending from an inner surface of the frame within the penetration region and spaced apart from each other along a circumferential direction, the loader blade configured to protrude the test board toward the semiconductor substrate, the loader blade connecting to the frame through the plurality of elastic structures, and a support tensioner configured to support the load pusher.
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