Method and system for fabricating a MEMS device

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12180069
APP PUB NO 20230045257A1
SERIAL NO

17877151

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A device includes a substrate and an intermetal dielectric (IMD) layer disposed over the substrate. The device also includes a first plurality of polysilicon layers disposed over the IMD layer and over a bumpstop. The device also includes a second plurality of polysilicon layers disposed within the IMD layer. The device includes a patterned actuator layer with a first side and a second side, wherein the first side of the patterned actuator layer is lined with a polysilicon layer, and wherein the first side of the patterned actuator layer faces the bumpstop. The device further includes a standoff formed over the IMD layer, a via through the standoff making electrical contact with the polysilicon layer of the actuator and a portion of the second plurality of polysilicon layers and a bond material disposed on the second side of the patterned actuator layer.

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Patent Owner(s)

Patent OwnerAddress
INVENSENSE INC1745 TECHNOLOGY DRIVE SUITE 200 SAN JOSE CA 95110

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Cuthbertson, Alan San Jose, US 103 1205
Lee, Daesung San Jose, US 160 2240

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