Heat dissipation device for electronic element
Number of patents in Portfolio can not be more than 2000
United States of America
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Dec 24, 2024
Grant Date -
Jan 19, 2023
app pub date -
Sep 18, 2022
filing date -
Sep 18, 2022
priority date (Note) -
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Abstract
A heat dissipation device for an electronic element includes a first chamber containing a printed circuit board with heating elements, and a second chamber for heat exchange. The second chamber contains a refrigerant injection part and supply part. A heat transfer part between the chambers receives heat from the heating elements and transfers it to the second chamber. A condensing part condenses injected refrigerant. The heat transfer part has evaporation-inducing ribs on its surface exposed to the second chamber, allowing injected liquid refrigerant to be adsorbed and flow downward in a zigzag pattern. This configuration enables efficient heat dissipation through phase changes of the refrigerant as it evaporates and condenses. The device may also include features like specially-shaped condensation ribs, a blower part to improve condensation, and a pressure regulator for the second chamber. This design provides improved heat dissipation performance without increasing device size.
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