Package designs to enable dual-sided cooling on a laser chip
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United States of America
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Dec 24, 2024
Grant Date -
Apr 21, 2022
app pub date -
Oct 21, 2020
filing date -
Oct 21, 2020
priority date (Note) -
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status (Latency Note)
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Abstract
Embodiments disclosed herein include dual sided cooling architectures for laser packages. In an embodiment, an electronic package comprises a package substrate, and a laser chip attached to the package substrate. In an embodiment, the laser chip has a first surface and a second surface opposite from the first surface. In an embodiment, an interposer is disposed over the laser chip, where the interposer overhangs an edge of the laser chip. In an embodiment, the electronic package further comprises an interconnect between the interposer and the package substrate.
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