Semiconductor structure and manufacturing method thereof
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United States of America
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Dec 24, 2024
Grant Date -
Mar 31, 2022
app pub date -
Oct 18, 2021
filing date -
Oct 18, 2021
priority date (Note) -
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Abstract
A semiconductor structure and a manufacturing method thereof are provided. A semiconductor structure includes a semiconductor body, bit lines and word lines. The semiconductor body includes a substrate and an isolation structure positioned above the substrate and configured to isolate a plurality of active regions, part of each of the active regions being formed from the substrate. The bit lines are positioned in the substrate and are connected to the active regions. The word lines intersect with the active regions and surround the active regions. The substrate is Silicon On Insulator (SOI) substrate.
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