Reflow method and system

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12176319
APP PUB NO 20230197671A1
SERIAL NO

18172988

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A system for reflowing a semiconductor workpiece including a stage, a first vacuum module and a second vacuum module, and an energy source is provided. The stage includes a base and a protrusion connected to the base, the stage is movable along a height direction of the stage relative to the semiconductor workpiece, the protrusion operably holds and heats the semiconductor workpiece, and the protrusion includes a first portion and a second portion surrounded by and spatially separated from the first portion. The first vacuum module and the second vacuum module respectively coupled to the first portion and the second portion of the protrusion, and the first vacuum module and the second vacuum module are operable to respectively apply a pressure to the first portion and the second portion. The energy source is disposed over the stage to heat the semiconductor workpiece held by the protrusion of the stage.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD8 LI-HSIN RD 6 HSINCHU SCIENCE PARK HSINCHU 300-78

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Wei-Yu Taipei, TW 709 6443
Cheng, Chia-Shen Hsinchu County, TW 41 146
Chung, Philip Yu-Shuan Taipei, TW 17 28
Hsieh, Ching-Hua Hsinchu, TW 265 2259
Kuo, Hsuan-Ting Taichung, TW 49 295
Lin, Hsiu-Jen Hsinchu County, TW 172 1408
Pei, Hao-Jan Hsinchu, TW 46 104
Wong, Cheng-Shiuan Hsinchu, TW 21 34

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