Thermal compression bonder nozzle with vacuum relief features
Number of patents in Portfolio can not be more than 2000
United States of America
Stats
-
Dec 24, 2024
Grant Date -
Jul 27, 2023
app pub date -
Apr 3, 2023
filing date -
Apr 3, 2023
priority date (Note) -
In Force
status (Latency Note)
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Abstract
An apparatus comprising a bonding nozzle that has one or more channels in a bonding surface. The one or more channels comprise a first channel portion in an inner region of the bonding surface and a second channel portion along an outer periphery of the bonding surface. The one or more channels are in fluid communication with a vacuum port. A vacuum relief conduit within the bonding nozzle comprises a first opening into the second channel portion along the outer periphery of the bonding surface, and a second opening along an exterior wall of the bonding nozzle.
First Claim
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International Classification(s)
- 2023 Application Filing Year
- H01L Class
- 19835 Applications Filed
- 4214 Patents Issued To-Date
- 21.25 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 0 Citation Count
- H01L Class
- 0 % this patent is cited more than
- 1 Age
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