Semiconductor device manufacturing device and manufacturing method
Number of patents in Portfolio can not be more than 2000
United States of America
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Dec 24, 2024
Grant Date -
Aug 11, 2022
app pub date -
Nov 12, 2020
filing date -
Nov 12, 2020
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Abstract
A semiconductor device manufacturing device (10) comprises: a stage (16) on which a substrate (100) is loaded; a bonding head (14) that is disposed facing the stage (16) and that bonds a semiconductor chip (110) to the substrate (100); and a controller (18). The bonding head (14) includes: an attachment (33) that holds the semiconductor chip (110) by suctioning; and a heating part (31) that detachably holds the attachment (33) and that heats the attachment (33). The heating part (31) has a first heating area (32a) and a second heating area (32b) that surrounds the first heating area (32a) in the horizontal direction. The controller (18) controls the temperatures of the first heating area (32a) and the second heating area (32b) independently.
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