Photosensitive resin composition, method for producing resist pattern film, method for producing plated formed product, and method for producing tin-silver plated-formed product
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United States of America
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Dec 24, 2024
Grant Date -
Feb 2, 2023
app pub date -
Mar 19, 2020
filing date -
Mar 19, 2020
priority date (Note) -
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Abstract
A photosensitive resin composition contains polymer (A) having an acid dissociative group, photoacid generator (B), and solvent (C), the solvent (C) containing 80 to 95% by mass of propylene glycol monomethyl ether acetate (C1) and 5 to 18% by mass of 3-methoxybutyl acetate (C2), a content ratio of other solvent (C3) in the solvent (C) being 0 to 10% by mass, and a content ratio of the solvent (C) contained in the photosensitive resin composition being less than 60% by mass.
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