Wire bonded common electrical connection in a piezoelectric micro-electro-mechanical system scanning mirror assembly
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United States of America
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Dec 24, 2024
Grant Date -
May 11, 2023
app pub date -
Jan 5, 2023
filing date -
Jan 5, 2023
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Abstract
Electrical connections are created between the actuator frame of a piezoelectric MEMS scanning mirror system and the substrate separate from the structural adhesive creating the mechanical bond between the actuator frame and the substrate. A structural bond (with no conducive properties) is formed between the actuator frame and the substrate. After the bond is fully formed, separate electric connections can be created by one or both of: 1) coating the actuator frame with a coating that enables a surface of the actuator frame to be wire bondable and creating a wire bond between the actuator frame and the substrate; or 2) depositing a trace of conductive material on the outside edge of the mechanical bond between the actuator frame and the substrate and a final protection layer may be applied over the conductive trace to protect the trace from mechanical or environmental damage.
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