High heat dissipation polymer composite material sheet and manufacturing method thereof
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United States of America
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Dec 24, 2024
Grant Date -
Apr 18, 2024
app pub date -
Feb 3, 2023
filing date -
Feb 3, 2023
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Abstract
There is provided a method for manufacturing a heat dissipation film. The method includes preparing a first mixture by mixing hexagonal boron nitride and an organic solvent, performing primary surface-modification on the hexagonal boron nitride, adding an amine-based silane compound to the first mixture, and then performing secondary surface-modification on the hexagonal boron nitride, preparing a second mixture by obtaining the secondarily surface-modified hexagonal boron nitride, and mixing the secondarily surface-modified hexagonal boron nitride, an imidazole-based curing agent, and an organic solvent, dispersing the second mixture, adding an epoxy resin to the second mixture, and then performing dispersion, and drying the organic solvent in the second mixture, and manufacturing a film using a product obtained by the drying.

First Claim
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- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
SAMDO ATS CO LTD | #2960-89 POSEUNGHYANGNAM-RO PALTAN-MYEON HWASEONG-SI GYEONGGI-DO 18532 |
International Classification(s)
- C08J:WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTE....
- C09K:MATERIALS FOR APPLICATIONS NOT OTHERWISE PROVIDED ....
- C08G:MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN B....
- B29C:SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTAN....
- C09C:TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBRO....
- C08K:USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUB....

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Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Jang, In Hwan | Pocheon-si, KR | 1 | 0 |
Kim, Hongsoo | Hwaseong-si, KR | 59 | 458 |
Lim, Taeyoon | Seoul, KR | 1 | 0 |
Park, Hyeok | Seoul, KR | 2 | 0 |
Yoo, Jaeseung | Seoul, KR | 1 | 0 |
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