Soldering tip assembly for an electric soldering device, in particular a soldering iron, soldering device, and soldering system
Number of patents in Portfolio can not be more than 2000
United States of America
Stats
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Dec 24, 2024
Grant Date -
Jan 4, 2024
app pub date -
Nov 9, 2021
filing date -
Nov 9, 2021
priority date (Note) -
In Force
status (Latency Note)
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Importance

US Family Size
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Non-US Coverage
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Abstract
The invention relates to a soldering tip assembly for an electric soldering device, in particular a soldering iron. The soldering tip assembly is designed to be releasably arranged on a soldering device handle which has a heating element, and the soldering tip assembly has a sleeve with a soldering tip provided on the distal end of the sleeve. The sleeve has an opening at the proximal end for introducing the heating element, wherein a holding element which at least partially surrounds the sleeve in an annular manner and a spring element which is provided between the holding element and the sleeve are provided, the spring element pushing the holding element in the distal direction. The sleeve has at least one stop arranged distally from the spring element. The stop secures the holding element against the soldering tip assembly in the distal direction.
First Claim
all claims..Other Claims data not available
Family
Country | kind | publication No. | Filing Date | Type | Sub-Type |
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DE | B4 | DE102020130464 | Nov 18, 2020 | Patent | Grant |
Type : Patent Sub-Type : Grant | |||||
PATENT (SECOND PUBLICATION) | Lötspitzenbaugruppe für ein elektrisches Lötgerät, insbesondere für einen Lötkolben, Lötgerät und Lötsystem | Feb 01, 2024 | |||
CN | A | CN116507440 | Nov 09, 2021 | Patent | Application |
Type : Patent Sub-Type : Application | |||||
UNEXAMINED APPLICATION FOR A PATENT FOR INV. | Soldering head assembly for an electric soldering device, in particular soldering iron, soldering device and soldering system | Jul 28, 2023 | |||
JP | B2 | JP7531061 | Nov 09, 2021 | Patent | Grant |
Type : Patent Sub-Type : Grant | |||||
PUBLISHED GRANTED PATENT (SECOND LEVEL) | 電気式のはんだ付け装置用の、特に、はんだごて用の、はんだ付けチップアセンブリ、はんだ付け装置及びはんだ付けシステム | Aug 08, 2024 | |||
WO | A1 | WO2022106258 | Nov 09, 2021 | Patent | Application |
Type : Patent Sub-Type : Application | |||||
INTERNATIONAL APPLICATION PUBLISHED WITH INTERNATIONAL SEARCH REPORT | LÖTSPITZENBAUGRUPPE FÜR EIN ELEKTRISCHES LÖTGERÄT, INSBESONDERE FÜR EINEN LÖTKOLBEN, LÖTGERÄT UND LÖTSYSTEM | May 27, 2022 | |||
ES | B2 | ES2944951 | Nov 09, 2021 | Patent | Grant |
Type : Patent Sub-Type : Grant | |||||
Patent published after examination without search report | Conjunto de puntas de soldadura para un dispositivo de soldadura eléctrica, en particular, para un soldador, dispositivo de soldadura y sistema de soldadura | Mar 07, 2025 | |||
MX | A | MX2023005847 | Nov 09, 2021 | Patent | Application |
Type : Patent Sub-Type : Application | |||||
PATENT APPLICATION | ENSAMBLAJE DE PUNTA DE SOLDADURA PARA UN DISPOSITIVO DE SOLDADURA ELECTRICO, EN PARTICULAR PARA UN CAUTIN, DISPOSITIVO DE SOLDADURA Y SISTEMA DE SOLDADURA. | Jun 02, 2023 |
- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
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ERSA GMBH | LEONHARD-KARL-STRASSE 24 WERTHEIM 97877 |
International Classification(s)

- 2021 Application Filing Year
- B23K Class
- 1924 Applications Filed
- 802 Patents Issued To-Date
- 41.69 % Issued To-Date
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Issler, Thorsten | Bütthard, DE | 5 | 6 |
# of filed Patents : 5 Total Citations : 6 | |||
Müller, Elmar | Dorfprozelten, DE | 2 | 5 |
# of filed Patents : 2 Total Citations : 5 | |||
Zimmermann, Peter | Aschaffenburg, DE | 38 | 543 |
# of filed Patents : 38 Total Citations : 543 |
Cited Art Landscape
- No Cited Art to Display

Patent Citation Ranking
- 0 Citation Count
- B23K Class
- 0 % this patent is cited more than
- 1 Age
Forward Cite Landscape
- No Forward Cites to Display

Maintenance Fees
Fee | Large entity fee | small entity fee | micro entity fee | due date |
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3.5 Year Payment | $1600.00 | $800.00 | $400.00 | Jun 24, 2028 |
7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Jun 24, 2032 |
11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Jun 24, 2036 |
Fee | Large entity fee | small entity fee | micro entity fee |
---|---|---|---|
Surcharge - 3.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
Surcharge - 7.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
Surcharge - 11.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
Full Text

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Dec 04, 2024 | STCF | INFORMATION ON STATUS: PATENT GRANT | free format text: PATENTED CASE |
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Aug 29, 2024 | STPP | INFORMATION ON STATUS: PATENT APPLICATION AND GRANTING PROCEDURE IN GENERAL | free format text: NOTICE OF ALLOWANCE MAILED -- APPLICATION RECEIVED IN OFFICE OF PUBLICATIONS |
Aug 10, 2024 | STPP | INFORMATION ON STATUS: PATENT APPLICATION AND GRANTING PROCEDURE IN GENERAL | free format text: RESPONSE TO NON-FINAL OFFICE ACTION ENTERED AND FORWARDED TO EXAMINER |
May 03, 2024 | STPP | INFORMATION ON STATUS: PATENT APPLICATION AND GRANTING PROCEDURE IN GENERAL | free format text: NON FINAL ACTION MAILED |
Jan 04, 2024 | P | Published | |
Sep 26, 2023 | STPP | INFORMATION ON STATUS: PATENT APPLICATION AND GRANTING PROCEDURE IN GENERAL | free format text: DOCKETED NEW CASE - READY FOR EXAMINATION |
May 16, 2023 | AS | ASSIGNMENT | free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:MUELLER, ELMAR;ZIMMERMANN, PETER;ISSLER, THORSTEN;SIGNING DATES FROM 20230215 TO 20230224;REEL/FRAME:063658/0263 Owner name: ERSA GMBH, GERMANY |
May 16, 2023 | FEPP | FEE PAYMENT PROCEDURE | free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |
Nov 09, 2021 | F | Filing | |
Nov 18, 2020 | PD | Priority Date |

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