Work table for laser processing and method of operating the same
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United States of America
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Dec 24, 2024
Grant Date -
May 19, 2022
app pub date -
Feb 4, 2022
filing date -
Feb 4, 2022
priority date (Note) -
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Abstract
A work table for laser processing includes an upper plate including a plurality of cell regions and at least one groove region that divides the plurality of cell regions. The upper plate includes a plurality of absorption holes that fix a substrate in the plurality of cell regions. A plurality of suction holes collect particles generated during a cutting process performed on the substrate. A lower plate is disposed under the upper plate. The lower plate forms an absorption path that is coupled to the plurality of absorption holes. A suction path is coupled to the plurality of suction holes by combining the lower plate with the upper plate.
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