Microelectronic devices, and related memory devices and electronic systems
Number of patents in Portfolio can not be more than 2000
United States of America
Stats
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Dec 17, 2024
Grant Date -
Feb 16, 2023
app pub date -
Aug 13, 2021
filing date -
Aug 13, 2021
priority date (Note) -
In Force
status (Latency Note)
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Importance

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Non-US Coverage
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Abstract
A microelectronic device comprises a base structure, a memory array overlying the base structure, and a conductive pad tier overlying the memory array. The base structure comprises a logic region including logic devices. The memory array comprises vertically extending strings of memory cells within a horizontal area of the logic region of the base structure. The conductive pad tier comprises first conductive pads substantially outside of the horizontal area of the logic region of the base structure, and second conductive pads horizontally neighboring the first conductive pads and within the horizontal area of the logic region of the base structure. Memory devices and electronic systems are also described.
First Claim
all claims..Other Claims data not available
Family

- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
MICRON TECHNOLOGY INC | 8000 SOUTH FEDERAL WAY BOISE ID 83707 |
International Classification(s)

- 2021 Application Filing Year
- H01L Class
- 28775 Applications Filed
- 15216 Patents Issued To-Date
- 52.88 % Issued To-Date
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Eruvuru, Surendranath C | Boise, US | 13 | 6 |
# of filed Patents : 13 Total Citations : 6 | |||
Piccardi, Michele | Cupertino, US | 81 | 174 |
# of filed Patents : 81 Total Citations : 174 | |||
Yu, Erwin E | San Jose, US | 27 | 52 |
# of filed Patents : 27 Total Citations : 52 |
Cited Art Landscape
- No Cited Art to Display

Patent Citation Ranking
- 0 Citation Count
- H01L Class
- 0 % this patent is cited more than
- 1 Age
Forward Cite Landscape
- No Forward Cites to Display

Maintenance Fees
Fee | Large entity fee | small entity fee | micro entity fee | due date |
---|---|---|---|---|
3.5 Year Payment | $1600.00 | $800.00 | $400.00 | Jun 17, 2028 |
7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Jun 17, 2032 |
11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Jun 17, 2036 |
Fee | Large entity fee | small entity fee | micro entity fee |
---|---|---|---|
Surcharge - 3.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
Surcharge - 7.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
Surcharge - 11.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
Full Text

Legal Events
Date | Code | Event | Description |
---|---|---|---|
Jul 26, 2023 | AS | ASSIGNMENT | free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:BOE TECHNOLOGY GROUP CO., LTD.;REEL/FRAME:064397/0480 Owner name: BEIJING BOE TECHNOLOGY DEVELOPMENT CO., LTD., CHINA Effective Date: Jul 26, 2023 |
Jun 21, 2022 | P | Publication | |
Jun 01, 2022 | STCF | INFORMATION ON STATUS: PATENT GRANT | free format text: PATENTED CASE |
May 24, 2022 | STPP | INFORMATION ON STATUS: PATENT APPLICATION AND GRANTING PROCEDURE IN GENERAL | free format text: PUBLICATIONS -- ISSUE FEE PAYMENT VERIFIED |
Feb 18, 2022 | STPP | INFORMATION ON STATUS: PATENT APPLICATION AND GRANTING PROCEDURE IN GENERAL | free format text: NOTICE OF ALLOWANCE MAILED -- APPLICATION RECEIVED IN OFFICE OF PUBLICATIONS |
Nov 04, 2021 | STPP | INFORMATION ON STATUS: PATENT APPLICATION AND GRANTING PROCEDURE IN GENERAL | free format text: NON FINAL ACTION MAILED |
Aug 20, 2021 | STPP | INFORMATION ON STATUS: PATENT APPLICATION AND GRANTING PROCEDURE IN GENERAL | free format text: DOCKETED NEW CASE - READY FOR EXAMINATION |
Aug 13, 2020 | P | Published | |
May 18, 2020 | STPP | INFORMATION ON STATUS: PATENT APPLICATION AND GRANTING PROCEDURE IN GENERAL | free format text: APPLICATION DISPATCHED FROM PREEXAM, NOT YET DOCKETED |
May 02, 2018 | FEPP | FEE PAYMENT PROCEDURE | free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |
Sep 15, 2017 | F | Filing | |
Feb 16, 2017 | PD | Priority Date |

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