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United States of America

PATENT NO 12170265
APP PUB NO 20210407966A1
SERIAL NO

17086479

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Abstract

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A semiconductor package includes a processor die, a storage module and a package substrate. The storage module includes an array of cache units and an array of memory units stacked over one another, and electrically connected to the processor die, wherein the array of cache units is configured to hold copies of data stored in the array of memory units and frequently used by the processor die. The package substrate is on which the processor die and the storage module are disposed.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTDNO 8 LI-HSIN ROAD 6 HSINCHU SCIENCE PARK HSINCHU 300

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Lin, Yu-Ming Hsinchu, TW 635 2287
Wu, Chao-I Hsinchu County, TW 181 1172
Yeong, Sai-Hooi Hsinchu County, TW 508 1349

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