Method of manufacturing a printed circuit board with a self-aligned setback
Number of patents in Portfolio can not be more than 2000
United States of America
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Dec 17, 2024
Grant Date -
N/A
app pub date -
Jan 3, 2023
filing date -
Jan 3, 2023
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Abstract
Electrical/magnetic components and methods of making such components are provided. One method includes providing a multilayer printed circuit board (PCB) including conductive features arranged on conductive layers of the PCB to form one or more windings around one or more predetermined axes. The method further includes forming a hole in the PCB at each of the one or more predetermined axes to accommodate one or more core legs. For each hole, an inner edge of one of the windings overlaps an edge of the hole in a lateral direction after the hole is formed. The method further includes assembling a magnetically permeable core including the one or more core legs, each core leg extending into one of the holes at the one or more predetermined axes.
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