Buffer configurations for communications between memory dies and a host device
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United States of America
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Dec 17, 2024
Grant Date -
Jun 29, 2023
app pub date -
Dec 22, 2022
filing date -
Dec 22, 2022
priority date (Note) -
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Abstract
Methods, systems, and devices for buffer configurations for communications between memory dies and a host device are described. A memory device may include a buffer having a first interface coupled with a host device and a second interface coupled with a memory die of the memory device. The first interface may communicate information with the host device at a first frequency and according to a first signaling scheme, and the second interface may communicate information with the memory die at a second frequency and according to a second signaling scheme. The first frequency may be higher than the second frequency, and the second signaling scheme may include a greater quantity of voltage levels than the first signaling scheme.
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