Bonding layer evaluation system and bonding layer evaluation method

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United States of America

PATENT NO 12169188
APP PUB NO 20220299479A1
SERIAL NO

17639471

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A bonding layer evaluation system includes an elastic wave generation device configured to generate an elastic wave at an evaluation object including a bonding layer; an elastic wave detection device configured to detect the elastic wave from the evaluation object; and a control device configured to evaluate a parameter related to the bonding layer of the evaluation object. The control device compares an actual value of a frequency characteristic of the elastic wave detected by the elastic wave detection device and a theoretical value of the frequency characteristic of the elastic wave calculated based on a theoretical model related to the evaluation object and evaluates the parameter related to the bonding layer based on a result of the comparison.

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Patent Owner(s)

Patent OwnerAddress
MITSUBISHI HEAVY INDUSTRIES LTDTOKYO 100
THE RITSUMEIKAN TRUST8 NISHINOKYO-HIGASHI-TOGANOO-CHO NAKAGYO-KU KYOTO-SHI KYOTO 6048520
KYOTO UNIVERSITYKYOTO CITY KYOTO-FU

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kamo, Sota Tokyo, JP 21 5
Matsuda, Naoki Kyoto, JP 229 1557
Mori, Naoki Shiga, JP 130 1430
Takagi, Kiyoka Tokyo, JP 40 27

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