Semiconductor device package and a method of manufacturing the same

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12168605
APP PUB NO 20210276860A1
SERIAL NO

17330245

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Abstract

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At least some embodiments of the present disclosure relate to a semiconductor device package. The semiconductor device package includes a substrate with a first groove and a semiconductor device. The first groove has a first portion, a second portion, and a third portion, and the second portion is between the first portion and the third portion. The semiconductor device includes a membrane and is disposed on the second portion of the first groove. The semiconductor device has a first surface adjacent to the substrate and opposite to the membrane. The membrane is exposed by the first surface.

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Patent Owner(s)

  • ADVANCED SEMICONDUCTOR ENGINEERING INC.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hsiao, Hsu-Liang Kaohsiung, TW 18 99
Huang, Ching-Han Kaohsiung, TW 28 72
Lai, Lu-Ming Kaohsiung, TW 68 134
Shen, Chia-Hung Kaohsiung, TW 6 12

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