Formable films, laminate structures, and related methods

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12168340
APP PUB NO 20220234803A1
SERIAL NO

17614855

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Abstract

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Embodiments of the disclosure relate to a blister package having a laminate structure that is heat-sealable to a lacquer layer on strain-hardened aluminum foil. The blister package includes a lid layer comprising a strain-hardened aluminum foil, a lacquer layer on a sealing surface of the strain-hardened aluminum foil and a laminate structure sealed directly to the lacquer layer. The laminate structure includes a multilayer film and a plurality of wells formed therethrough. The multilayer film includes a first formable layer of a thermoplastic material and a sealing layer of a copolyester material. The sealing layer overlies the first formable layer and has an outer surface opposite the first formable layer. The sealing layer has crystallinity from 5% to 20% as measured by differential scanning calorimetry (DSC). The outer surface of the sealing layer is sealed directly against the lacquer layer.

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Patent Owner(s)

Patent OwnerAddress
FLEX FILMS (USA) INC1221 NORTH BLACK BRANCH ROAD ELIZABETHTOWN KY 42701

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Boral, Dipak Noida, IN 1 2
Chaturvedi, Ashok New Delhi, IN 25 79
Gupta, Sanjeev Noida, IN 46 539
Naik, Sudhir Noida, IN 9 37
Sargeant, Steven Elizabethtown, US 21 154
Sirsamkar, Pramod Noida, IN 4 9

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