Semiconductor light emitting device and method for manufacturing the same

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12166162
APP PUB NO 20230411581A1
SERIAL NO

18459763

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Abstract

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A semiconductor light emitting device includes a semiconductor light source, a resin package surrounding the semiconductor light source, and a lead fixed to the resin package. The lead is provided with a die bonding pad for bonding the semiconductor light source, and with an exposed surface opposite to the die bonding pad The exposed surface is surrounded by the resin package in the in-plane direction of the exposed surface.

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Patent Owner(s)

  • ROHM CO., LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Itai, Junichi Kyoto, JP 21 203
Kobayakawa, Masahiko Kyoto, JP 113 895
Mireba, Kazuhiro Kyoto, JP 15 144
Okada, Taisuke Kyoto, JP 14 103
Yasuda, Shintaro Kyoto, JP 13 80

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