Semiconductor device

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12165990
APP PUB NO 20230178498A1
SERIAL NO

18162720

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A semiconductor device includes a substrate, an electronic component, a stiffener ring and an adhesive ring. The substrate has a first surface and a second surface opposite to the first surface. The electronic component is over the first surface of the substrate. The stiffener ring is over the first surface of the substrate. The stiffener ring includes a plurality of side parts and a plurality of corner parts coupled to the side parts. Heights of the corner parts are less than heights of the side parts. The adhesive ring is interposed between the first surface of the substrate and the stiffener ring. The adhesive ring includes a plurality of side portions and a plurality of corner portions coupled to the side portions. Thicknesses of the side portions are less than thicknesses of the corner portions.

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Patent Owner(s)

  • TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hsu, Shu-Chia Hsinchu, TW 14 44
Huang, Kuan-Yu Taipei, TW 69 208
Huang, Sung-Hui Yilan County, TW 113 535
Huang, Szu-Po Taichung, TW 36 869
Lee, Hsiang-Fan Hsinchu, TW 39 1805
Li, Pai-Yuan Taichung, TW 8 27

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