Wafer adaptor for adapting different sized wafers
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United States of America
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Dec 10, 2024
Grant Date -
Oct 20, 2022
app pub date -
Apr 18, 2022
filing date -
Apr 18, 2022
priority date (Note) -
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status (Latency Note)
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Abstract
A wafer adaptor ring assembly for adapting an adapted sized wafer for plasma dicing by a plasma etch chamber designed for dicing a designed sized wafer, which is larger than the adapted sized wafer is disclosed. The wafer adaptor ring assembly includes a primary wafer ring designed for plasma dicing the designed sized wafer by the plasma, an adhesive sheet attached to a bottom surface of the primary wafer ring, and an adapted sized wafer disposed on the adhesive sheet between the primary wafer ring and the adapted sized wafer. A method for forming the wafer adaptor ring assembly is also disclosed.
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