Substrate support and substrate processing apparatus

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12165896
APP PUB NO 20210327741A1
SERIAL NO

17273009

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Importance

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Abstract

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A substrate support is provided that includes: a base; an electrostatic chuck on which a substrate is placed; an electrode provided in the electrostatic chuck; a contact portion of the electrode; an adhesive layer that bonds the electrostatic chuck with the base and that does not cover the contact portion; and a power supply terminal contacting the contact portion of the electrode without being fixed to the contact portion.

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First Claim

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Patent Owner(s)

Patent OwnerAddress
TOKYO ELECTRON LIMITED3-1 AKASAKA 5-CHOME MINATO-KU TOKYO 1076325 ?1076325

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Nagayama, Akira Miyagi, JP 29 211
Sasaki, Yasuharu Miyagi, JP 99 2172
Tomioka, Taketoshi Miyagi, JP 9 49
Yamaguchi, Shin Miyagi, JP 51 417

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