Method for reducing charging of semiconductor wafers

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12165867
APP PUB NO 20230386820A1
SERIAL NO

18225576

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Abstract

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Embodiments are directed to a method for minimizing electrostatic charges in a semiconductor substrate. The method includes depositing photoresist on a semiconductor substrate to form a photoresist layer on the semiconductor substrate. The photoresist layer is exposed to radiation. The photoresist layer is developed using a developer solution. The semiconductor substrate is cleaned with a first cleaning liquid to wash the developer solution from the photoresist layer. A tetramethylammonium hydroxide (TMAH) solution is applied to the semiconductor substrate to reduce charges accumulated in the semiconductor substrate.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTDNO 8 LI-HSIN RD 6 HSINCHU SCIENCE PARK HSINCHU 300-78

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chang, Wei-Lin Hsinchu, TW 22 16
Chen, Chun-Chang Hsinchu, TW 49 328
Chen, Sz-Fan Hsinchu, TW 9 7
Cheng, Chihy-Yuan Hsinchu, TW 9 10
Kuo, Ching-Sen Hsinchu, TW 40 113
Lin, Chien-Hung Hsinchu, TW 169 878
Shiu, Feng-Jia Hsinchu, TW 62 349
Wang, Chih-Chien Hsinchu, TW 21 306

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