Wafer cleaning apparatus and wafer cleaning method using the same
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United States of America
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Dec 10, 2024
Grant Date -
Mar 17, 2022
app pub date -
May 12, 2021
filing date -
May 12, 2021
priority date (Note) -
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Abstract
A wafer cleaning method is provided. The wafer cleaning method includes providing a wafer on a stage that is inside of a chamber. The wafer is fixed to the stage by moving a grip pin connected to an edge of the stage. First ultrapure water is supplied onto the wafer while the wafer is rotating at a first rotation speed. The grip pin is released from the wafer by moving the grip pin. A development process is performed by supplying liquid chemical onto the wafer while the wafer is rotating at a second rotation speed that is less than the first rotation speed.
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