Signal routing between memory die and logic die

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12165696
APP PUB NO 20230046050A1
SERIAL NO

17830981

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Abstract

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A memory device includes a memory die bonded to a logic die via a wafer-on-wafer bond. A controller of the memory device that is coupled to the memory die can activate a row of the memory die. Responsive to activating the row, a sense amplifier stripe of the memory die can latch a first plurality of signals. A transceiver can route a second plurality of signals from the sense amplifier stripe to the logic die.

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Patent Owner(s)

Patent OwnerAddress
MICRON TECHNOLOGY INCBOISE ID

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Eilert, Sean S Penryn, US 88 1235
Hush, Glen E Boise, US 231 3326
Parekh, Kunal R Boise, US 328 3273
Zaidy, Aliasger T Seattle, US 13 4

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