Off-module data buffer
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United States of America
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Dec 10, 2024
Grant Date -
Oct 5, 2023
app pub date -
Mar 1, 2023
filing date -
Mar 1, 2023
priority date (Note) -
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Abstract
In a modular memory system, a memory control component, first and second memory sockets and data buffer components are all mounted to the printed circuit board. The first and second memory sockets have electrical contacts to electrically engage counterpart electrical contacts of memory modules to be inserted therein, and each of the data buffer components includes a primary data interface electrically coupled to the memory control component, and first and second secondary data interfaces electrically coupled to subsets of the electrical contacts within the first and second memory sockets, respectively.
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