Microbump cluster probing architecture for 2.5D and 3D dies
Number of patents in Portfolio can not be more than 2000
United States of America
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Dec 10, 2024
Grant Date -
Oct 5, 2023
app pub date -
Mar 31, 2022
filing date -
Mar 31, 2022
priority date (Note) -
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Abstract
The present disclosure is directed to an inspection tool having a probe head with a probe card with a plurality of probes for performing testing, each of the probes being configured with a first end attached to the probe card and a second end for engaging microbumps coupled to a semiconductor die, the plurality of probes including a first set of probes having a first cross-sectional dimension, the first set of probes being arranged in a first set of locations on the probe card, and a second set of probes having a second cross-sectional dimension, the second set of probes being arranged in a second set of locations on the probe card, and a stage for holding the semiconductor die.
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