Wafer wet cleaning system
Number of patents in Portfolio can not be more than 2000
United States of America
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Dec 10, 2024
Grant Date -
Mar 26, 2020
app pub date -
Jul 24, 2019
filing date -
Jul 24, 2019
priority date (Note) -
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Abstract
The present disclosure describes a wafer cleaning process in which a drained cleaning solution, which is used to remove metal contaminants from the wafer, is sampled and analyzed to determine the concentration of metal ions in the solution. The wafer cleaning process includes dispensing, in a wafer cleaning station, a chemical solution on one or more waters; collecting the dispensed chemical solution; determining a concentration of contaminants in the chemical solution; in response to the concentration of the contaminants being greater than a baseline value, adjusting one or more parameters in the cleaning process; and in response to the concentration of the contaminants being equal to or less than the baseline value, transferring the one or more wafers out of the wafer cleaning station.
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