Circuit board
Number of patents in Portfolio can not be more than 2000
United States of America
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Dec 3, 2024
Grant Date -
Jul 6, 2023
app pub date -
May 21, 2021
filing date -
May 21, 2021
priority date (Note) -
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status (Latency Note)
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Abstract
A circuit board according to an embodiment includes an insulating layer including an upper surface and a lower surface, and having a via hole passing through the upper surface and the lower surface in a thickness direction from the upper surface to the lower surface, wherein the via hole includes: a first via part adjacent to the upper surface and having a constant inclination angle along the thickness direction; a second via part adjacent to the lower surface and having a constant inclination angle along the vertical direction; and a third via part disposed between the first via part and the second via part and having an inclination angle different from an inclination angle of the first via part and an inclination angle of the second via part.
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