Metal ribs in electromechanical devices

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12160219
APP PUB NO 20230396230A1
SERIAL NO

18454034

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Abstract

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In examples, a device comprises a semiconductor die, a thin-film layer, and an air cavity positioned between the semiconductor die and the thin-film layer. The air cavity comprises a resonator positioned on the semiconductor die. A rib couples to a surface of the thin-film layer opposite the air cavity.

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Patent Owner(s)

  • AGILENT TECHNOLOGIES TEXAS INSTRUMENTS INCORPORATED

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Matsuura, Masamitsu Beppu, JP 35 71
Nguyen, Hau San Jose, US 29 87
Poddar, Anindya Sunnyvale, US 96 798

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