Semiconductor device

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12159843
APP PUB NO 20220302045A1
SERIAL NO

17472474

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A semiconductor device according to an embodiment includes a lower layer wiring and a dummy wiring arranged in a first hierarchy, a contact arranged in a second hierarchy above the first hierarchy and connected to the lower layer wiring, and first and second plate-like portions arranged in the second hierarchy, extending in a stacking direction of each layer belonging to the second hierarchy and in a first direction intersecting with the stacking direction, and sandwiching the contact in a second direction intersecting with the stacking direction and the first direction at a position away from the contact, and the dummy wiring has at least three edges arranged at respective positions overlapping with one of the first and second plate-like portions in the stacking direction, and an orientation in which at least one of the three edges intersects with the first or second plate-like portion differs as viewed from the stacking direction from orientations in which the other edges intersect with the first or second plate-like portion.

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First Claim

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Patent Owner(s)

Patent OwnerAddress
KIOXIA CORPORATION1-21 SHIBAURA 3-CHOME MINATO-KU TOKYO 1080023 ?1080023

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kawamura, Daisuke Kiyosu, JP 120 1147

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