Wireless power transfer thin profile coil assembly

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12159745
APP PUB NO 20200168393A1
SERIAL NO

16615290

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A thin resonant induction wireless power transmission transfer coil assembly designed for low loss and ease of manufacturing includes one or more printed circuit boards having a first conductor pattern wound in a spiral on a first side and a second conductor pattern wound in a spiral on a second side thereof, where the second conductor pattern is aligned with the first conductor pattern whereby the second conductor pattern reinforces magnetic flux generated by the first conductor pattern. The first and second conductor patterns are placed relative to one another so as to provide flux transmission in a same direction. One or more of such printed circuit boards form a wireless power transmission coil assembly with a conductive winding layer, a ferrite flux diversion layer, conformal spacing layers, an eddy current shield layer and an assembly enclosure.

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Patent Owner(s)

  • INDUCTEV INC.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Cohen, Benjamin H Malvern, US 6 84
Daga, Andrew W Malvern, US 19 69
Keener, Moses M Philadelphia, US 1 2
Long, Bruce Richard Malvern, US 11 104
McMahon, Francis J Malvern, US 22 42
Schrafel, Peter C Philadelphia, US 6 6
Wolgemuth, John M Horsham, US 7 9

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