Designs and manufacturing methods for lightweight hyperdamping materials providing large attenuation of broadband-frequency structure-borne sound

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United States of America

PATENT NO 12158190
APP PUB NO 20230383807A1
SERIAL NO

18087869

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Abstract

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A hyperdamping inclusion under constraint with large, broadband frequency damping properties is disclosed. The inclusion includes materials under near-buckling constraint such that fundamental eigenfrequency vanishes at near-buckling.

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Patent Owner(s)

Patent OwnerAddress
OHIO STATE INNOVATION FOUNDATION1050 CARMACK RD MOUNT HALL 1ST FLOOR COLUMBUS OH 43210

International Classification(s)

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  • 2022 Application Filing Year
  • F16F Class
  • 505 Applications Filed
  • 180 Patents Issued To-Date
  • 35.65 % Issued To-Date

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Harne, Ryan L Columbus, US 4 10

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Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges6961701 - 10050100150200250300350400450500550600650700750

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