Vapor chamber for cooling an electronic component, electronic arrangement, and method for manufacturing the vapor chamber
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United States of America
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Nov 26, 2024
Grant Date -
Jun 16, 2022
app pub date -
Dec 15, 2021
filing date -
Dec 15, 2021
priority date (Note) -
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Abstract
A vapor chamber includes a bottom cover, a top cover, a crate element, and at least one porous pillar. The bottom cover is configured to receive waste heat from an electronic component. The top cover is arranged on the bottom cover, and the bottom cover and the top cover are formed such that a vapor cavity configured to accommodate a liquid is formed between the bottom and top cover. The crate element is configured to provide mechanical strength to the vapor chamber, and has at least one compartment. The compartment(s) are formed by at least three side panels that are connected to each other, where the at least three side panels extend from the bottom cover to the top cover. The porous pillar(s) are configured to transfer the liquid from the top cover to the bottom cover and are arranged in the compartment.
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