Package carrier with improved heat dissipation efficiency and manufacturing method thereof

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12156325
APP PUB NO 20220159824A1
SERIAL NO

17137293

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Importance

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Abstract

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A package carrier includes a circuit structure layer and a heat-conducting element. The circuit structure layer includes a notch portion. The heat-conducting element includes a first heat-conducting portion and a second heat-conducting portion vertically connected to the first heat-conducting portion. The notch portion exposes the first heat-conducting portion, and an outer surface of the second heat-conduction portion is aligned with a side surface of the circuit structure layer.

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Patent Owner(s)

Patent OwnerAddress
UNIMICRON TECHNOLOGY CORPTAOYUAN 330

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Hsuan-Wei New Taipei, TW 14 6
Po, Chi-Chun New Taipei, TW 6 2
Wu, Ming-Hao Taoyuan, TW 28 65

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