Samarium-silver alloy clad structure for charging terminals and manufacturing method thereof
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United States of America
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Nov 26, 2024
Grant Date -
Jun 15, 2023
app pub date -
Jan 27, 2021
filing date -
Jan 27, 2021
priority date (Note) -
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Abstract
A layered structure for forming charging terminals for high power applications. In some embodiments, the layered structure may include a substrate and a contact layer disposed over at least a portion of the substrate. The substrate may have a conductivity greater than 40% International Annealed Copper Standard (IACS). The contact layer may demonstrate a coefficient of friction of less than 1.4, such as from 0.1 to 1.4, as measured in accordance with American Society of Testing and Materials (ASTM) G99-17. The contact layer may include a precious-metal-based alloy, such as a silver-samarium alloy.
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