Solder reflow apparatus and method of manufacturing an electronic device

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12154882
APP PUB NO 20240047410A1
SERIAL NO

18126858

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A solder reflow apparatus includes a vapor generating chamber configured to accommodate a heat transfer fluid and to accommodate saturated vapor generated by heating the heat transfer fluid; a heater configured to heat the heat transfer fluid accommodated in the vapor generating chamber; a substrate stage configured to be movable upward and downward within the vapor generating chamber, the substrate stage including a seating surface; vapor passages penetrating the substrate stage and configured to allow the vapor to move therethrough; and suction passages penetrating the substrate stage to be open to the seating surface and in which at least a partial vacuum is generated.

First Claim

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Patent Owner(s)

Patent OwnerAddress
SAMSUNG ELECTRONICS CO LTDSUWON-SI

International Classification(s)

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  • 2023 Application Filing Year
  • H01L Class
  • 19835 Applications Filed
  • 4214 Patents Issued To-Date
  • 21.25 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances2023202420250255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kim, Youngja Suwon-si, KR 19 2

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Patent Citation Ranking

  • 0 Citation Count
  • H01L Class
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  • 1 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges3335716251501 - 1011 - 20020004000600080001000012000140001600018000200002200024000260002800030000320003400036000

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