Systems for integrated decomposition and scanning of a semiconducting wafer
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United States of America
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Nov 26, 2024
Grant Date -
Oct 21, 2021
app pub date -
Apr 12, 2021
filing date -
Apr 12, 2021
priority date (Note) -
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Abstract
Systems and methods are described for integrated decomposition and scanning of a material, such as a semiconducting wafer, a scanning nozzle includes, but is not limited to, a nozzle body defining one or more nozzle ports to receive fluid for introduction to the surface of the material and to recover fluid from the surface of the material, and a nozzle hood extending from the nozzle body, the nozzle hood defining an inner channel longitudinally disposed along the nozzle body, the nozzle hood further defining one or more outer channels longitudinally disposed along the nozzle body, the inner channel fluidically coupled with the one or more outer channels via one or more gaps defined by the nozzle hood.
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