Mold compounds and packages for encapsulating electronic components

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12152133
APP PUB NO 20220127463A1
SERIAL NO

17502859

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Importance

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Abstract

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A package and method of manufacturing a package is disclosed. In one example, a package for encapsulating an electronic component includes a first cured mold compound, wherein the first cured mold compound includes a resin and filler particles embedded in the resin. The filler particles include a second cured mold compound. The first cured mold compound is based on a first curing act and the second cured mold compound is based on a second curing act different from the first curing act.

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Patent Owner(s)

Patent OwnerAddress
INFINEON TECHNOLOGIES AGAM CAMPEON 1-15 NEUBIBERG 85579

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Schwab, Stefan Regensburg, DE 35 162
Waterloo, Andreas Regensburg, DE 3 0

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