Filler-loaded high thermal conductive dispersion liquid composition having excellent segregation stability, method for producing said dispersion liquid composition, filler-loaded high thermal conductive material using said dispersion liquid composition, method for producing said material, and molded article obtained using said material

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12152113
APP PUB NO 20240092981A1
SERIAL NO

18491613

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Abstract

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A problem of heat dissipation in motors, converters, high-luminance LEDs, power devices, power supplies, and the like becomes significant. Provided is a means for capable of providing a product, which has favorable workability, segregation stability, storage stability, and the like, penetrates into a gap in a coil portion, an interface in casing, and the like without any gaps, enhances thermal conductivity/heat dissipation properties of a molded product thus obtained, and is excellent in electrical characteristics, toughness/elastic modulus, thermal resistance, thermal cycle properties, and the like, in the case of using the product for a cast molding resin, a potting material (sealing material), an adhesive, grease, and the like.

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Patent Owner(s)

Patent OwnerAddress
TAKAGI CHEMICALS INC21-1 AZA-HORITA OBATA-CHO OKAZAKI-SHI AICHI-KEN 444-3502

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Matsuyama, Kazuo Okazaki, JP 31 217
Nagatani, Yuusuke Okazaki, JP 6 14
Takagi, Masakuni Okazaki, JP 6 20
Takagi, Noriaki Okazaki, JP 78 560
Terao, Yuuta Okazaki, JP 4 14
Watanabe, Daisuke Okazaki, JP 311 1900

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