Dual-type solder ball placement system
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United States of America
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Nov 26, 2024
Grant Date -
Mar 23, 2023
app pub date -
Jul 1, 2020
filing date -
Jul 1, 2020
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Abstract
A dual-type solder ball placement system is capable of allowing solder balls of the same type or solder balls having two different types to be mounted simultaneously through two ball mounting lines, thereby efficiently mounting the solder balls arranged with various purposes and patterns. Specifically, the dual-type solder ball placement system allows solder balls serving as terminals and core balls serving as supports to be mounted simultaneously through an inline method, thereby preventing a wafer, a unit, a chipset, and the like that become lighter, thinner, shorter, and smaller from being bent.
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