Method for manufacturing shielded printed wiring board and shielded printed wiring board

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12150239
APP PUB NO 20210410272A1
SERIAL NO

17298394

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Importance

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Abstract

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A shielded printed wiring board with electromagnetic wave shielding film on both sides thereof is produced by placing electromagnetic wave shielding films on the two sides of the printed wiring board, with ends thereof protruding past an end of the printed wiring board. The protruding ends of the electromagnetic wave shielding films are brought together, with an air gap therebetween, and an initial application of heat and pressure causes the ends of the electromagnetic wave shielding film to adhere to each other, but without completely curing adhesive resin components of the electromagnetic wave shielding films. Protective film layers are removed from the electromagnetic wave shielding films, followed by subsequent application of heat and pressure to complete cure of the adhesive resin and to remove the air gap.

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First Claim

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Patent Owner(s)

Patent OwnerAddress
TATSUTA ELECTRIC WIRE & CABLE CO LTD3-1 IWATACHO 2-CHOME HIGASHIOSAKA-SHI OSAKA 5788585 ?5788585

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Haruna, Yuusuke Kizugawa, JP 16 9
Katsuki, Takahiko Kizugawa, JP 7 7
Tajima, Hiroshi Kizugawa, JP 50 215
Yamauchi, Sirou Kizugawa, JP 8 42

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