Photocurable composition and method for producing semiconductor device
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United States of America
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Nov 19, 2024
Grant Date -
Aug 3, 2023
app pub date -
Mar 30, 2023
filing date -
Mar 30, 2023
priority date (Note) -
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Abstract
A photocurable composition for forming coating film having flattening properties on a substrate, with high fillability into patterns and capability of forming a coating film that is free from thermal shrinkage, which contains at least one compound that contains a photodegradable nitrogen-containing and/or photodegradable sulfur-containing structure, a hydrocarbon structure, and a solvent. The compound may have the photodegradable nitrogen-containing and/or photodegradable sulfur-containing structure and the hydrocarbon structure in one molecule, or may be a combination of compounds which contain the structures in separate molecules.
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