Cooling device, semiconductor manufacturing apparatus, and semiconductor manufacturing method
Number of patents in Portfolio can not be more than 2000
United States of America
Stats
-
Nov 19, 2024
Grant Date -
Dec 30, 2021
app pub date -
Jun 23, 2021
filing date -
Jun 23, 2021
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A cooling device includes a circulation system configured to circulate a refrigerant in a condenser so as to return the refrigerant to the condenser via a pump, a heater, a throttle valve, and a vaporizer; and a cooling system that includes a heat exchanger arranged in the condenser. The condenser includes a first portion where the refrigerant is present in a liquid state and a second portion where the refrigerant is present in a gas state, and at least a portion of the heat exchanger is arranged in the second portion.
First Claim
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International Classification(s)
- 2021 Application Filing Year
- H01J Class
- 2475 Applications Filed
- 1245 Patents Issued To-Date
- 50.31 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 0 Citation Count
- H01J Class
- 0 % this patent is cited more than
- 1 Age
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 3.5 Year Payment | $1600.00 | $800.00 | $400.00 | May 19, 2028 |
| 7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | May 19, 2032 |
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | May 19, 2036 |