Cooling apparatus for electronic element
Number of patents in Portfolio can not be more than 2000
United States of America
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Nov 12, 2024
Grant Date -
Nov 3, 2022
app pub date -
Jul 14, 2022
filing date -
Jul 14, 2022
priority date (Note) -
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Abstract
A cooling apparatus for an electronic element includes a first chamber in a non-vacuum state, the first chamber being configured such that a printed circuit board equipped with a heat-generating element is disposed in the first chamber, a second chamber in a vacuum state, the second chamber being configured such that a spray unit configured to spray a refrigerant and a refrigerant supply unit configured to supply the refrigerant to the spray unit are disposed in the second chamber, and an evaporation unit disposed between the first chamber and the second chamber, in which the spray unit sprays the refrigerant, which is supplied by the refrigerant supply unit and condensed in the second chamber, into the second chamber, and in which the evaporation unit evaporates the refrigerant, which is sprayed into the second chamber by the spray unit.
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